µPILR™ MEDIA KIT
Tessera introduces the µPILR™ interconnect platform, a highly innovative technology family that is designed to revolutionize the interconnect within semiconductor packages, substrates, printed wiring boards (PWBs) and other electronic components.
Press Release
Press Release (Chinese translation)
Press Release (Japanese translation)
Press Presentation
Press Presentation (Japanese Translation)
FAQ
Photographs
µPILR™ Flash Package-on-Package (Top View)
µPILR™ Flash Package-on-Package (Bottom View)
µPILR™ DRAM Package-on-Package
µPILR™ DRAM Package-on-Package (Top View)
µPILR™ DRAM Package-on-Package (Bottom View)
µPILR™ DRAM Package-on-Package (Side View)
µPILR™ vs. Conventional BGA Package
Technical Collateral
µPILR™ Datasheet
µPILR™ Interconnect Technology
µPILR™ Interconnect Technology (Japanese)
µPILR™ Interconnect Technology (Korean)
µPILR™ Interconnect Technology (Chinese TW)
µPILR™ Interconnect Technology (Chinese PRC)
Corporate Documents
Tessera Milestones
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