Since 1990, Tessera has been developing technologies that have anticipated and successfully addressed market demands for smaller, higher-performing electronic products at lower cost. By meeting these requirements, the company's technology has enabled the development of a broad range of electronics used by millions of people every day. Cellular phones, PDAs, PCs, laptops, gaming consoles, MP3 players, hearing implants and defense electronics are just a few of the products that incorporate Tessera's patented technology.
Tessera's product offering includes a wide range of semiconductor packaging, interconnect and consumer optics technologies. In the packaging & interconnect space, Tessera's µZ® multi-chip product line builds on the company's foundational µBGA® chip-scale technology and enables adopters to stack multiple chips within the footprint of a single package. Tessera's wafer-level SHELLCASE technology offering makes it possible to package images sensors and other optical devices in form factors essentially identical in size to the chip itself. The company's consumer optics technologies are used to shape and influence light and are integrated into a number of applications, including semiconductor equipment optics and communications devices.
Tessera opened its research and development facilities in Yokohama, Japan in February of 2007. This facility is focused on addressing the challenges of electronic products miniaturization from a system perspective, specifically through the dense interconnection of components, extensive use of three-dimensional packaging technologies, and the use of micro-optics technologies. Our advanced packaging substrate efforts focus on developing packaging prototypes that utilize and leverage the benefits of our substrate technology and working with customers to incorporate our technology into their products.
If you are interested in learning more, please contact us at info@tessera.com.
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